UB Tech® 2019 kicks off with pre-conference summits on digital learning and emerging technologies
The UB Tech® 2019 conference in Orlando kicked off with pre-conference summits focused on cutting-edge technology, leadership and the future of digital learning in higher ed.
ClassLink sponsored the summit titled Measuring ROI on Digital Learning: The Impact of Access and Analytics, which explored ways in which easy access to digital resources can impact the full student life cycle, from recruitment to application, retention and through to completion.
The sessions also covered why institutions are moving toward next-generation platforms to enable access to learning resources; the role that utilization analytics can have in informing strategic-level decisions; and how single sign-on and analytics platforms are changing the way that institutions plan, deploy and evaluate digital learning resources.
HP sponsored the summit titled Meeting University Challenges in the Fourth Industrial Revolution, which explored how a variety of new technologies can create the “Campus of the Future” that will positively impact the academic world, and can address real-life trends impacting students, faculty and the institution as a whole.
The discussion focused on preparing the institution for the Fourth Industrial Revolution, and how technologies such as additive manufacturing (3D printing), extended reality and online virtual classrooms will transform teaching and learning on and off campus.
Interested in technology? Keep up with the UB Tech® conference.